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Ramuc Epoxy Patching Compound – Superior Bond, Single Application

Original price was: $44.33.Current price is: $13.30.

SKU: 1536 Category:

Description

Ramuc® Epoxy Patching Compound is a two-part epoxy resin that does not sag, run, or shrink. Its thick formula allows it to fill large cavities in a single application

Ramuc® Epoxy Patching Compound creates a superior bond to all epoxies, polyester resins, fiberglass, metals and concrete. It can be sanded, machined, cut, filed, planed, drilled and tapped, making it perfect for filling, filleting, forming, fairing, and fastening. This low odor formula is resistant to chemicals and is safe to use above and below the waterline. Epoxy Patching Compound can be molded and shaped during application and can be over coated by most paints.

  • Will not sag, run or shrink
  •  For large or small repairs
  •  Remains flexible
  •  Can be molded or shaped
  •  Use above or below the waterline

Compatibility: Adhesion to most porous surfaces

SURFACE PREPARATION: Surface must be clean, dry, structurally sound and free of old caulk, dirt, dust & other foreign material. Depending on the joint surface, for best results it may require a thorough wire brushing, grinding, sandblasting and solvent washing the roughened surface will enhance bond. Taping sides of joint is recommended in any size where an extremely accurate match to the edge is desired.

APPLICATION: The dual component cartridge acts as a mixing control system to assure a perfect mixing ratio of Component A and B (2:1). Remove the screw cap and place the open cartridge in the cartridge gun. Squeeze out as much product as you think you will need (the smaller the working batch the better) onto a plastic palette or rigid surface. Mix both components with a spatula or putty knife until the purple color has disappeared. You should now have a uniform clear mixture on your palette. If mixture does not have a pinkish color it may sag but all other properties will remain unchanged. Spread the mixture over the palette in a thin layer. This increases the working time and allows you to keep air bubbles to a minimum. If you make a fresh batch on the same palette, you do not have to wait until the old mixture has hardened and the palette has been cleaned. First apply a thin layer on the parts or spots that need repairing or bonding to assure good contact with the substrate. Then apply the rest of the mixture to the area being worked on and model it into the desired form. The maximum working time of this product is between 20 to 25 minutes at a temperature of 77°F (25°C). Do not continue working on the area after this time, because the epoxy will sag. After a full cure (minimum 16 hours at 77°F [25°C]) the area can be ground, planed, routed, filed, sanded and then painted. Ramuc Thinner is ideal for cleaning up of work areas and tools before the epoxy hardens.

CLEAN UP: Ramuc Thinner – 1 Gallon (gal)

USEFUL TIPS:

  • Do not use in the rain or at temperatures below 40°F. At temperatures of 40°-55°F, the curing time will be longer than 16 hours.
  • Flexible plastic palettes and plastic putty knives are easy to clean. Once the product hardens, just bend the plastic palette or putty knife backward and forward until the hardened resin becomes loose.
  • Use Plexiglas strips or sheets for complicated corner, edge and large hole repairs to ensure a 100% smooth filling.
  • Not all plastics can be bonded together with this product. Always test first. Apply Ramuc Thinner on a piece of cloth or tissue and rub over a small area of the plastic. If the plastic becomes sticky, the product will bond to the plastic.
  • For the best results when using this product as fairing, cover the faired area with thin polypropylene or polyethylene film and roll the product smooth with a roller cage and roller cover over the film. After curing (approximately 16 hours) peel the plastic sheet off. This will produce a smooth finish that will require less sanding time prior to over coating.
  • Do not apply polyester gel-coat over this product.

Ramuc – Epoxy Patching Compound